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ICPADM - Call for Abstracts Closing Soon

By anc, 24 November 2014


The International Conference on the Properties and Applications of Dielectric Materia (ICPADM) is fully sponsored by the IEEE Dielectrics and Electrical Insulation Society.

This triennial Conference, established since 1985, is the premier insulation and dielectric materials forum for Asia.  

Click here for further information.